bga - Fabricación de equipos electrónicos

Master BGA Designer Suite

Fabricación de sistemas electrónicos

http://www.cad-design.com/software/icpackaging_design_technology.html

A BGA PCB is a printed circuit board that instead of pins for connection to external circuitry, it has solder ball contacts, which come from the IC's that use that connection technology. It has the advantage of having high 'pin' density, that other packaging technologies don't have, but a disadvantage is expensive testing of solder joints. This kind of PCB is mostly use in the connections for CPU's. A BGA PCB is a printed circuit board that instead of pins for connection to external circuitry, i.......

Fabricación de sistemas electrónicos

https://pcbreference.blogspot.com/2009/12/bga-or-ball-grid-array-pcb.html

Fabricación de sistemas electrónicos

http://dangerousprototypes.com/2012/01/03/workshop-sjaak-solders-a-qfn-and-bga-chip-2

El siguiente video muestra como soldar y desoldar un integrado BGA con una pistola de calor.

Fabricación de sistemas electrónicos

http://ayudaelectronica.com/e/desoldar

Ball Grid Array test sockets are a prototyping and testing tool that is used in verifying the effectiveness of a soldering process to the pcb when using BGA chips. They are basically the same as production sockets, but may incorporate features that will allow measurement or analysis of the resulting product when testing for connectivity to the printed circuit board or assuring reliable solder points. Ball Grid Array test sockets are a prototyping and testing tool that is used in verifying the ef.......

https://pcbreference.blogspot.com/2009/12/bga-test-sockets.html

http://dangerousprototypes.com/blog/2012/03/01/workshop-video-bga-revisited

El siguiente video muestra como soldar y desoldar un integrado BGA con una pistola de calor

http://ayudaelectronica.com/video-desoldar-chips-smc

Keywords: BGA, PCB design, Stencil Design, Reflow and Rework APPLICATION NOTE 6408 BALL GRID ARRAY (BGA) PACKAGE APPLICATION NOTES Abstract: This application note discusses Maxim Integrated's BGA packages, and provides PCB design and board assembly process guidelines. Introduction Maxim's BGA packages consist of one or more dice connected to a laminate substrate in either wire-bonded or flip-chip configurations. Some [..].......

http://pdfserv.maximintegrated.com/en/an/AN6408.pdf

Speed, band width and low power continue to be key goals for semiconductor DRAM memories. The article below discusses DDR4, LPDDR4, and GDDR5, DIMMS, and JEDEC standards. Some of the same issues are also key concerns for NAND flash memories. However, 3D NAND fabrication processes are closer to production. RonInsightful, timely, and accurate semiconductor consulting. Semiconduc.......

https://semiconductorexpert.blogspot.com/2015/01/nand-flash-dram-2015-trends.html

The LTM®8055 is a 36VIN, buck-boost power module (power module) regulator. Included in the package are the switching controller, power switches, inductor and support components. A resistor to set the switching frequency, a resistor divider to set the output voltage, and input and output capacitors are all that are needed to complete the design. Other features such as input and output average current regulation may be implemented with just a few components. The LTM8055 operates over an input vol.......

http://feedproxy.google.com/~r/LinearTechnologyFeed-Datasheets/~3/PR6k4M6rXSY/LTM8055

Linear Technology?s µModule (micromodule) DC/DC power products are complete system-in-package (SiP) power management solutions with integrated DC/DC controller, power transistors, input and output capacitors, compensation components and inductor within a compact, surface mount BGA or LGA package. µModule power products support functions as Step-Down (buck), Step-Down and Step-Up (buck-boost), Battery Charger, Isolated Converter, and LED driver. As a highly integrated solution with PCB Gerber f.......

http://www.linear.com/products/umodule_regulators

The UCD90320 device is a 32-rail PMBus addressable power sequencer and system manager in a compact 0. 8-mm pitch BGA package. The 24 integrated ADC channels (AMONx) monitor the power supply voltage, current, and temperature. Eighty-four GPIO pins can be used for 8 digital monitor (DMONx), 32 power supply enable. . . The UCD90320 device is a 32-rail PMBus addressable power sequencer and system manager in a compact 0. 8-mm pitch BGA package. The 24 integrated ADC channels (AMONx) monitor the power.......

http://www.ti.com/product/ucd90320

Todo sobre la reparación de Televisiones de LCD y Plasma. Averías, consultas sobre averías. Contiene las últimas noticias sobre los avances de la tecnología audiovisual.

http://www.reparacionlcd.com

SchmartBoard -"Electronic Circuit Building Blocks" TM "ez" Product Catalog www.schmartboard.com 02/07 5) Two problems impede people's ability to hand solder surface mount components. First, placing and holding the components in [. . . . . ]

http://www.electronicaestudio.com/docs/catalogo.pdf

Product, Process and Circuit Design, Electronic Design Automation, EDA, ASIC Design, Engineering and Design Services. Manufacturing Services. R&D.

http://design.dapj.com/2011_09_01_archive.html