bga - Fabricación de equipos electrónicos

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BGA or Ball Grid Array PCB

A BGA PCB is a printed circuit board that instead of pins for connection to external circuitry, it has solder ball contacts, which come from the IC's that use that connection technology. It has the advantage of having high 'pin' density, that other packaging technologies don't have, but a disadvantage is expensive testing of solder joints. This kind of PCB is mostly use in the connections for CPU's. A BGA PCB is a printed circuit board that instead of pins for connection to external circuitry, i.......

Fabricación de sistemas electrónicos

http://pcbreference.blogspot.com/2009/12/bga-or-ball-grid-array-pcb.html


Master BGA Designer Suite (MBGAD) by CAD Design Software

Master BGA Designer Suite

Fabricación de sistemas electrónicos

http://www.cad-design.com/software/icpackaging_design_technology.html


Charla técnica gratuita: Soldadura SMD y BGA

Charla técnica gratuita en la ciudad de Rosario sobre Soldadura SMD y BGA”. Temario: Tecnologías de Circuitos impresos. Tecnologías de Componentes electrónicos Proceso de soldado y las tecnologías asociadas Estaños y Fluxes Herramientas para soldado y retrabajo de circuitos impresos ... Continue Reading ...

Fabricación de sistemas electrónicos

http://www.automatismos-mdq.com.ar/blog/2016/08/charla-tecnica-gratuita-soldadura-smd-y-bga.html


Workshop video #01: Sjaak solders a QFN chip, attempts the BGA challenge | Dangerous Prototypes

Fabricación de sistemas electrónicos

http://dangerousprototypes.com/2012/01/03/workshop-sjaak-solders-a-qfn-and-bga-chip-2



 desoldar | Ayuda Electronica desoldar | Ayuda Electronica

El siguiente video muestra como soldar y desoldar un integrado BGA con una pistola de calor.

Fabricación de sistemas electrónicos

http://ayudaelectronica.com/e/desoldar


Quality & Lead-free (Pb-free): Packaging InformationQuality & Lead-free (Pb-free): Packaging Information

At Texas Instruments, semiconductor packaging is an integral part of the design process and strategic differentiator for our analog and embedded processing products.

Fabricación de sistemas electrónicos

http://www.ti.com/lsds/ti/packaging/packaginghome.page


BGA Test Sockets

Ball Grid Array test sockets are a prototyping and testing tool that is used in verifying the effectiveness of a soldering process to the pcb when using BGA chips. They are basically the same as production sockets, but may incorporate features that will allow measurement or analysis of the resulting product when testing for connectivity to the printed circuit board or assuring reliable solder points. Ball Grid Array test sockets are a prototyping and testing tool that is used in verifying the ef.......

http://pcbreference.blogspot.com/2009/12/bga-test-sockets.html


Workshop Video #10: BGA revisited | Dangerous Prototypes

http://dangerousprototypes.com/2012/03/01/workshop-video-bga-revisited


[video] Desoldar chips SMC

El siguiente video muestra como soldar y desoldar un integrado BGA con una pistola de calor

http://ayudaelectronica.com/video-desoldar-chips-smc


pdfAN6408

Keywords: BGA, PCB design, Stencil Design, Reflow and Rework APPLICATION NOTE 6408 BALL GRID ARRAY (BGA) PACKAGE APPLICATION NOTES Abstract: This application note discusses Maxim Integrated's BGA packages, and provides PCB design and board assembly process guidelines. Introduction Maxim's BGA packages consist of one or more dice connected to a laminate substrate in either wire-bonded or flip-chip configurations. Some [..].......

http://pdfserv.maximintegrated.com/en/an/AN6408.pdf


UPDATED: LTM4649 - 10A Step-Down DC/DC ?Module Regulator

The LTM®4649 is a complete 10A high efficiency switching mode step-down DC/DC μModule® regulator in a 9mm × 15mm × 4. 92 BGA package. Included in the package are the switching controller, power FETs, inductor, and all support components. Operating over an input voltage range of 4.5V to 16V, the LTM4649 supports an output voltage range of 0. 6V to 3. 3V, set by a single external resistor. This high efficiency design delivers 10A continuous current. Only bulk input and output capaci.......

http://feedproxy.google.com/~r/LinearTechnologyFeed-Datasheets/~3/RBH0CtUMTWk/LTM4649


NAND Flash, DRAM 2015 Trends

Speed, band width and low power continue to be key goals for semiconductor DRAM memories. The article below discusses DDR4, LPDDR4, and GDDR5, DIMMS, and JEDEC standards. Some of the same issues are also key concerns for NAND flash memories. However, 3D NAND fabrication processes are closer to production. RonInsightful, timely, and accurate semiconductor consulting. Semiconduct.......

http://semiconductorexpert.blogspot.com/2015/01/nand-flash-dram-2015-trends.html


µModule Regulators - Linear Technology

Linear Technology?s µModule (micromodule) DC/DC power products are complete system-in-package (SiP) power management solutions with integrated DC/DC controller, power transistors, input and output capacitors, compensation components and inductor within a compact, surface mount BGA or LGA package. µModule power products support functions as Step-Down (buck), Step-Down and Step-Up (buck-boost), Battery Charger, Isolated Converter, and LED driver. As a highly integrated solution with PCB Gerber fil.......

http://www.linear.com/products/umodule_regulators


Low Cost, octal Ultrasound Receiver with on-Chip RF Decimator and JESD204B Serial Interface | Analog to Digital Converters | A/D Converters | Press Re.......

Analog Devices, Inc. (NASDAQ: ADI) introduced today the AD9675 8-channel Ultrasound Analog Front End (AFE) with on-chip RF decimator and JESD204B serial interface, designed for mid- to high-end portable and cart-based medical and industrial ultrasound systems. The device integrates eight channels of low-noise amplifier, variable-gain amplifier, anti-aliasing filter, and 14-bit A/D converter with the industry as highest sample rate (125 MSPS) and best SNR (signal-to-noise ratio) performance (75 d.......

http://www.analog.com/en/analog-to-digital-converters/ad-converters/ad9272/products/02_22_13_Low_Cost_Octal_Ultrasound_Receiver/press.html


UCD90320 32-Rail PMBus Power Sequencer and System Manager | TI.com

The UCD90320 device is a 32-rail PMBus addressable power sequencer and system manager in a compact 0. 8-mm pitch BGA package. The 24 integrated ADC channels (AMONx) monitor the power supply voltage, current, and temperature. Eighty-four GPIO pins can be used for 8 digital monitor (DMONx), 32 power supply enable. . . The UCD90320 device is a 32-rail PMBus addressable power sequencer and system manager in a compact 0. 8-mm pitch BGA package. The 24 integrated ADC channels (AMONx) monitor the power.......

http://www.ti.com/product/ucd90320


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