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an-1133
Application Note AN-1133 SupIRBuckTM MCM Power Quad Flat No-lead (PQFN) Inspection Application Note Table of Contents Page Inspection techniques . . 3 Examples of good assembly . 3 Summary [. . ]
http://www.irf.com/technical-info/appnotes/an-1133.pdf
EvoxRifaRFIandSMD
X and Y Capacitors Copyright ©2007 KEMET EMI Capacitors on the AC Line X capacitors are across the line. If they short-circuit, the risk is fire. X Y Y Y [. . ]
http://www.kemet.com/kemet/web/homepage/kechome.nsf/file/KEMET Kollege Presentations/$file/EvoxRifaRFIandSMD.pdf
AND8081-D
AND8081/D Flip Chip CSP Packages https://onsemi.com Introduction to Chip Scale Packaging APPLICATION NOTE on each exposed UBM pad and reflowed to create an interconnection system ready for board assembly. Once the bumps are [. . ]
http://www.onsemi.com/pub/Collateral/AND8081-D.PDF
cc2500_ds_1_2_rus_part
CC2500 CC2500 Low-Cost Low-Power 2. 4 GHz RF Transceiver Applications 2400-2483.5 MHz ISM/SRD band systems Consumer electronics Wireless game controllers Wireless audio Wireless keyboard [. . ]
http://andromega.narod.ru/doc/cc2500_ds_1_2_rus_part.pdf
EVAL-AD5292
Evaluation Board for the 10-Bit, Serial Input, High Voltage Digital Potentiometer EVAL-AD5292EBZ FEATURES Full-featured evaluation board for the AD5292 Wiper buffer 4-wire ohm measurement capability Various link [. . ]
https://www.analog.com/static/imported-files/eval_boards/EVAL-AD5292.pdf
Surface Mount Soldering Recommendations
The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip.
http://www.littelfuse.com/data/en/Application_Notes/AN1005.pdf
AN40-014
01 fo 1 egaP . stiucriC-iniM fo ytreporp eht era stnetnoc sti dna tnemucod sihT cod.41004NA :eliF )21/72/10( 963531M RO :. veR 410-04-NA SURFACE MOUNT ASSEMBLY OF MINI-CIRCUITS COMPONENTS DATE [. . ]
http://www.minicircuits.com/app/AN40-014.pdf
AN6407
Keywords: Power Module, LGA, PCB design, Stencil Design, APPLICATION NOTE 6407 POWER MODULE LAND GRID ARRAY (LGA) PACKAGING AND ITS APPLICATIONS Abstract: This application note discusses Maxim's power module LGA packages, and provides PCB design and board assembly process guidelines. Introdu.......
http://pdfserv.maximintegrated.com/en/an/AN6407.pdf